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Brand Name : Cansec Wireless
Model Number : AN1312HA-E
Place of Origin : Beijing
MOQ : 100
Price : USD 5.46$ per piece
Payment Terms : T/T
Supply Ability : 2000000 pieces per year
Delivery Time : 5~8 weeks
Packaging Details : Box for 1000 pieces Package size: 40*34*20 cm Gross weight: 5.000 kg
size : 15mm*22mm(+25mm antenna)*3.2mm
TX Power : 13dBm
RX sensitivity : -124dBm
TX current : 25mA
RX current : 5.5mA
Standby current : 1uA
Antenna : Helix Connector
Chipset : CC1312 by Texas Instruments
Frequency : 434/868/915MHz
Reach : 800m max
Working Tempurature : -20~+70℃
Working Voltage : 1.8~3.8v
Cansec Wireless AN1312HA-A TI CC1312R1F3 Smart industry Long Range Sub-GHz Module

| Parameter | Min | Typ | Max | Unit | |
| Operating Voltage | 1.8 | - | 3.8 | V | |
| Operating Temperature | -20 | - | +70 | ℃ | |
| Current Consumption | Sleep Mode | - | 1 | - | uA |
| Receive mode | - | 8 | - | mA | |
| Transmit Mode | - | 27 | - | mA | |
| TX Power (For Carrier) | - | 12 | dBm | ||
| RX Sensitivity (For Lora Modulation) | - | - | -121 | dBm | |
| Distance | 434 / 470MHz:400-500 868 / 915MHz:600-800 | m | |||
Cansec Wireless AN1312HA-A TI CC1312R1F3 Smart industry Long Range Sub-GHz Module
Description
The AN1312 module is designed based on CC1312R. The CC1312R device is a Sub-1GHz wireless MCU targeting Wireless M-Bus, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), KNX RF, Wi-SUN®, and proprietary systems, including theTI15.4-Stack.
The CC1312R device is a member of the SimpleLink™ MCU platform of cost-effective, ultra-low power,2.4-GHz and Sub-1 GHz RF devices. Very low active RF and microcontroller (MCU) currents, in addition to sub-μA sleep current with up to 80KB of parity protected RAM retention, provide excellent battery lifetime and allow operation on small coin-cell batteries and in energy-harvesting applications.
The CC1312R device combines a flexible, very low-power RF transceiver with a powerful 48-MHz Arm® Cortex®-M4F CPU in a platform supporting multiple physical layers and RF standards. A dedicated Radio Controller (Arm® Cortex®-M0) handles low-level RF protocol commands that are stored in ROM or RAM, thus ensuring ultra-low power and great flexibility. The low power consumption of the CC1312R device does not come at the expense of RF performance; the CC1312R device has excellent sensitivity and robustness (selectivity and blocking) performance.
The CC1312R device is a highly integrated, true single-chip solution incorporating a complete RF system and an on-chip DC/DC converter. Sensors can be handled in a very low-power manner by a programmable, autonomous
ultra-low power Sensor Controller CPU with 4KB of SRAM for program and data. The Sensor Controller, with its fast wake-up and ultra-low-power 2 MHz mode is designed for sampling, buffering, and processing both analog and digital.
Application
- 433-, 470- to 510-, 868-, and 902 to 928 MHz ISM and SRD Systems with down to 4 kHz of receive bandwidth
- Home and building automation
- Building security systems – motion detector, electronic door lock, door and window sensor, gateway
- HVAC – thermostat, wireless environmental sensor, HVAC system controller
- Fire safety systems – smoke detector, fire alarm control panel
- Video surveillance – IP camera
- Garage door openers
- Elevator and escalator control
- Smart grid and automatic meter reading
- Water, gas, and electricity meters
- Heat cost allocators
- Gateways
- Wireless sensor networks
- Long-range sensor applications
- Asset tracking and management
- Factory automation
- Wireless healthcare applications
- Energy harvesting applications
- Electronic Shelf Label (ESL)

| Pad Number | Name | Pin Type | Description |
| 1 | GND | Ground Pin | Connect to GND |
| 2 | DIO_1 | Digital I/O | GPIO, |
| 3 | DIO_2 | Digital I/O | GPIO |
| 4 | DIO_3 | Digital I/O | GPIO |
| 5 | DIO_4 | Digital I/O | GPIO |
| 6 | DIO_5 | Digital I/O | GPIO, High drive capability |
| 7 | DIO_6 | Digital I/O | GPIO, High drive capability |
| 8 | DIO_7 | Digital I/O | GPIO, High drive capability |
| 9 | GND | Ground Pin | Connect to GND |
| 10 | VDD | Power | 1.8V to 3.8V main chip supply |
| 11 | DIO_8 | Digital I/O | GPIO |
| 12 | DIO_9 | Digital I/O | GPIO |
| 13 | DIO_10 | Digital I/O | GPIO |
| 14 | DIO_11 | Digital I/O | GPIO |
| 15 | DIO_12 | Digital I/O | GPIO |
| 16 | DIO_13 | Digital I/O | GPIO |
| 17 | DIO_14 | Digital I/O | GPIO |
| 18 | DIO_15 | Digital I/O | GPIO |
| 19 | JTAG_TMSC | Digital I/O | JTAG TMSC, High drive capability |
| 20 | JTAG_TCKC | Digital I/O | JTAG TCKC |
| 21 | DIO_16 | Digital I/O | GPIO, JTAG_TDO, High drive capability |
| 22 | DIO_17 | Digital I/O | GPIO, JTAG_TDI, High drive capability |
| 23 | DIO_18 | Digital I/O | GPIO |
| 24 | DIO_19 | Digital I/O | GPIO |
| 25 | DIO_20 | Digital I/O | GPIO |
| 26 | DIO_21 | Digital I/O | GPIO |
| 27 | DIO_22 | Digital I/O | GPIO |
| 28 | RESET_N | Digital input | Reset, active low. Internal pullup resistor |
| 29 | DIO_23 | Digital/Analog I/O | GPIO, analog capability |
| 30 | DIO_24 | Digital/Analog I/O | GPIO, analog capability |
| 31 | DIO_25 | Digital/Analog I/O | GPIO, analog capability |
| 32 | DIO_26 | Digital/Analog I/O | GPIO, analog capability |
| 33 | DIO_27 | Digital/Analog I/O | GPIO, analog capability |
| 34 | DIO_28 | Digital/Analog I/O | GPIO, analog capability |
| 35 | DIO_29 | Digital/Analog I/O | GPIO, analog capability |
| 36 | DIO_30 | Digital/Analog I/O | GPIO, analog capability |
| 37 | GND | Ground Pin | Connect to GND |
| 38 | ANT | RF_OUT | Antenna Type: NA RF_OUT |
| 39 | GND | Ground Pin | Connect to GND |
Note: The MCU IOC can map a number of peripheral modules such as GPIO,
SSI (SPI), UART, I2C, and I2S to any of the available I/Os.
The peripherals AUX and JTAG are limited to specific I/O pins.More information please reference Ti.com.







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TI CC1312R1F3 Long Range Sub GHz Module Cansec Wireless AN1312HA-E Images |